Dublin, Oct. 21, 2013 (GLOBE NEWSWIRE) -- Research and Markets
(http://www.researchandmarkets.com/research/7w9xr4/stmicroelectronics)
has announced the addition of the
"STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing
Analysis" report to their offering.
System Plus Consulting is proud to publish the reverse costing
report of the new 9-DOF IMU supplied by
STMicroelectronics.
The LSM333D is a 4x4mm system-in-package featuring a
3axisgyroscope, a 3-axis accelerometer and a
3-axismagnetometer.
ST achieves to obtain this package footprint by combining the
3-axis gyroscope and the 3-axis accelerometer function on the same
die. This new structure, combined with an Au-Au hermetic bonding
process allow ST's to shrink the 6-axis function by more than
35%.
The LSM333D is targeted for portable applications: indoor
navigation, smart user interface, advanced gesture recognition,
gaming and virtual reality input device It provides accurate output
across full-scale ranges up to ±2000dps (rotational acceleration),
±16g (linear acceleration) and ±12 Gauss (magnetic field).
This report provides complete teardown of the 9-Axis IMU with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Key Topics Covered:
Overview / Introduction
Executive Summary
Reverse Costing Methodology
Companies Profile
Physical Analysis
- Package X-Ray
- Package Opening
- Package Cross-Section
- ASICs Dimensions
- ASICs Delayering
- ASICs Cross-Section
- MEMS Gyro/Accelero Dimensions
- MEMS Gyro/Accelero Cap Opening
- MEMS Gyro/Accelero Sensing Areas
- MEMS Gyro/Accelero Cross-sections
- X/Y-Axis Magnetometer Dimensions
- X/Y-Axis Magnetometer Delayering
- X/Y-Axis Magnetometer Cross-section
- Z-Axis Magnetometer Dimensions
- Z-Axis Magnetometer Delayering
- Z-Axis Magnetometer Cross-section
Manufacturing Process Flow
- Front-End Manufacturing Process Flows
- Description of the Wafers Fabrication Units
- Back-End Packaging Process Flow
- Back-End Packaging Assembly Unit
Cost Analysis
- Yields Hypotheses
- ASICs Wafer Cost
- ASICs Die Cost
- MEMS Gyro/Accelero Wafer Cost
- MEMS Gyro/Accelero Die Cost
- X/Y-Axis Magnetometer Wafer Cost
- X/Y-Axis Magnetometer Die Cost
- Z-Axis Magnetometer Wafer Cost
- Z-Axis Magnetometer Die Cost
- Back-End: Packaging Cost
- Back-End: Final test & Calibration Cost
- LSM333D Component Cost (FE + BE 0 + BE 1)
Estimated Price Analysis
- Manufacturer Financial Ratios
- LSM333D Estimated Selling Price
For more information visit
http://www.researchandmarkets.com/research/7w9xr4/stmicroelectronics
Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector:
Telecommunications and Networks